Critical Plasma Processing Parameters for Improved Strength of Wire Bonds
نویسندگان
چکیده
Bond pad cleaning, prior to wire bonding, through the employment of radio-frequency-driven, lowpressure plasmas has been demonstrated to improve the wire bond pull strength.1 The successful application of plasma technology relies on an optimization of process parameters including process pressure, plasma power, time, and process gas type. These key plasma process parameters and their impact on wire bond pull strength are discussed.
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